H300 slot nozzle (BS)
The UES high precision module H300 is well suited for standard application of glue at normal application speed. The module processes glue with a viscosity up to 20,000mPas/s at a maximum switching speed of 4,000p/min (depends on the triggering). For fast openings air pressure is applied to the module .
Slot nozzle modules are designed to fit ideal to the applicator body. Because in most cases several modules are mounted to one body it is necessary to adjust the glue application with each module. The integrated fine adjustment makes it easy to define the glue application of each module separately.
H300 spray module (SP)
The UES high precision module H300 is well suited for standard application of glue at normal application speed. The module processes glue with a viscosity up to 20,000mPas/s at a maximum switching speed of 4,000p/min (depends on the triggering). For fast openings air pressure is applied to the module .
The spray module has an additional input for compressed air. Once the air escapes through the symmetrically arranged bore holes constant glue swirling is provided. The modules are used on glue applicators with integrated heat exchanger. The sprayed glue has a sharply edge and is scarcely visible.
H400 for large glue amounts
With a maximum bore diameter of 3.6mm, the module H400 is particularly suitable for application with a very high glue flow rate.
It is the right choice if you need a large quantity of glue.
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